An authoritative, systematic, and comprehensive description of current CMP technology Chemical Mechanical Planarization (CMP) provides the greatest degree of planarization of any known technique. The current standard for integrated circuit (IC) planarization, CMP is playing an increasingly important role in other related applications such as microelectromechanical systems (MEMS) and computer hard drive manufacturing. This reference focuses on the chemical aspects of the technology and includes contributions from the foremost experts on specific applications. After a detailed overview of the fundamentals and basic science of CMP, Microelectronic Applications of Chemical Mechanical Planarization: * Provides in-depth coverage of a wide range of state-of-the-art technologies and applications * Presents information on new designs, capabilities, and emerging technologies, including topics like CMP with nanomaterials and 3D chips * Discusses different types of CMP tools, pads for IC CMP, modeling, and the applicability of tribometrology to various aspects of CMP * Covers nanotopography, CMP performance and defect profiles, CMP waste treatment, and the chemistry and colloidal properties of the slurries used in CMP * Provides a perspective on the opportunities and challenges of the next fifteen years Complete with case studies, this is a valuable, hands-on resource for professionals, including process engineers, equipment engineers, formulation chemists, IC manufacturers, and others. With systematic organization and questions at the end of each chapter to facilitate learning, it is an ideal introduction to CMP and an excellent text for students in advanced graduate courses that cover CMP or related semiconductor manufacturing processes.

An authoritative, systematic, and comprehensive description ofcurrent CMP technologyChemical Mechanical Planarization (CMP) provides the greatestdegree of planarization of any known technique. The currentstandard for integrated circuit (IC) planarization, CMP is playingan increasingly important role in other related applications suchas microelectromechanical systems (MEMS) and computer hard drivemanufacturing. This reference focuses on the chemical aspects ofthe technology and includes contributions from the foremost expertson specific applications. After a detailed overview of thefundamentals and basic science of CMP, Microelectronic Applicationsof Chemical Mechanical Planarization:* Provides in-depth coverage of a wide range of state-of-the-arttechnologies and applications* Presents information on new designs, capabilities, and emergingtechnologies, including topics like CMP with nanomaterials and 3Dchips* Discusses different types of CMP tools, pads for IC CMP, modelingand the applicability of tribometrology to various aspects ofCMP* Covers nanotopography, CMP performance and defect profiles, CMPwaste treatment, and the chemistry and colloidal properties of theslurries used in CMP* Provides a perspective on the opportunities and challenges of thenext fifteen yearsComplete with case studies, this is a valuable, hands-on resourcefor professionals, including process engineers, equipmentengineers, formulation chemists, IC manufacturers, and others. Withsystematic organization and questions at the end of each chapter tofacilitate learning, it is an ideal introduction to CMP and anexcellent text for students in advanced graduate courses that coverCMP or related semiconductor manufacturing processes.