The proposed book will offer comprehensive and versatile methodologies and recommendations on how to determine dynamic characteristics of typical micro- and opto-electronic structural elements (printed circuit boards, solder joints, heavy devices, etc.) and how to design a viable and reliable structure that would be able to withstand high-level dynamic loading. Particular attention will be given to portable devices and systems designed for operation in harsh environments (such as automotive, aerospace, military, etc.) In-depth discussion from a mechanical engineer's viewpoint will be conducted to the key components level as well as the whole device level. Both theoretical (analytical and computer-aided) and experimental methods of analysis will be addressed. The authors will identify how the failure control parameters (e.g. displacement, strain and stress) of the vulnerable components may be affected by the external vibration or shock loading, as well as by the internal parameters of the infrastructure of the device. Guidelines for material selection, effective protection and test methods will be developed for engineering practice.

The proposed book will offer comprehensive and versatilemethodologies and recommendations on how to determine dynamiccharacteristics of typical micro- and opto-electronic structuralelements (printed circuit boards, solder joints, heavy devicesetc.) and how to design a viable and reliable structure that wouldbe able to withstand high-level dynamic loading. Particularattention will be given to portable devices and systems designedfor operation in harsh environments (such as automotive, aerospacemilitary, etc.) In-depth discussion from a mechanicalengineer's viewpoint will be conducted to the key components'level as well as the whole device level. Both theoretical(analytical and computer-aided) and experimental methods ofanalysis will be addressed. The authors will identify how thefailure control parameters (e.g. displacement, strain and stress)of the vulnerable components may be affected by the externalvibration or shock loading, as well as by the internal parametersof the infrastructure of the device. Guidelines for materialselection, effective protection and test methods will be developedfor engineering practice.

Preface.Contributors.1 Some Major Structural Dynamics-Related Failure Modes andMechanisms in Micro- and Opto-Electronic Systems and DynamicStability of These Systems (David S. Steinberg).2 Linear Response to Shocks and Vibrations (EphraimSuhir).3 Linear and Nonlinear Vibrations Caused by Periodic Impulses(Ephraim Suhir).4 Random Vibrations of Structural Elements in Electronic andPhotonic Systems (Ephraim Suhir).5 Natural Frequencies and Failure Mechanisms of Electronic andPhotonic Structures Subjected to Sinusoidal or Random Vibrations(David S. Steinberg).6 Drop/Impact of Typical Portable Electronic Devices:Experimentation and Modeling (T. X. Yu and C. Y. Zhou).7 Shock Test Methods and Test Standards for Portable ElectronicDevices (C. Y. Zhou, T. X. Yu, S. W. Ricky Lee, and EphraimSuhir).8 Dynamic Response of Solder Joint Interconnections to Vibrationand Shock (David S. Steinberg).9 Test Equipment, Test Methods, Test Fixtures, and Test Sensorsfor Evaluating Electronic Equipment (David S.Steinberg).10 Correlation between Package-Level High-Speed Solder BallShear/Pull and Board-Level Mechanical Drop Tests with BrittleFracture Failure Mode, Strength, and Energy (Fubin Song, S. W.Ricky Lee, Keith Newman, Bob Sykes, and Stephen Clark).11 Dynamic Mechanical Properties and Microstructural Studies ofLead-Free Solders in Electronic Packaging (V. B. C. Tan, K. C.Ong, C. T. Lim, and J. E. Field).12 Fatigue Damage Evaluation for Microelectronic ComponentsSubjected to Vibration (T. E. Wong).13 Vibration Considerations for Sensitive Research andProduction Facilities (E. E. Ungar, H. Amick, and J. A.Zapfe).14 Applications of Finite Element Analysis: Attributes andChallenges (Metin Ozen).15 Shock Simulation of Drop Test of Hard Disk Drives (D. W.Shu, B. J. Shi, and J. Luo).16 Shock Protection of Portable Electronic Devices Using a"Cushion" of an Array of Wires (AOW) (EphraimSuhir).17 Board-Level Reliability of Lead-Free Solder under MechanicalShock and Vibration Loads (Toni T. Matilla, Pekka Marjamaki, andJorma Kivilahti).18 Dynamic Response of PCB Structures to Shock Loading inReliability Tests (Milena Vujosevic and Ephraim Suhir).19 Linear Response of Single-Degree-of-Freedom System to ImpactLoad: Could Shock Tests Adequately Mimic Drop Test Conditions?(Ephraim Suhir).20 Shock Isolation of Micromachined Device for High-gApplications (Sang-Hee Yoon, Jin-Eep Roh, and Ki LyugKim).21 Reliability Assessment of Microelectronics Packages UsingDynamic Testing Methods (X. Q. Shi, G. Y. Li, and Q. J.Yang).22 Thermal Cycle and Vibration/Drop Reliability of Area ArrayPackage Assemblies (Reza Ghaffarian).23 Could an Impact Load of Finite Duration Be Substituted withan Instantaneous Impulse? (Ephraim Suhir and LucianoArruda).Index.