Polycrystalline Silicon for Integrated Circuit Applications
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Polycrystalline Silicon for Integrated Circuit Applications

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ISBN-13:
9781461316817
Veröffentl:
2012
Einband:
PDF
Seiten:
290
Autor:
Ted Kamins
Serie:
The Springer International Series in Engineering and Computer Science
eBook Typ:
PDF
eBook Format:
PDF
Kopierschutz:
Adobe DRM [Hard-DRM]
Sprache:
Englisch
Beschreibung:

Recent years have seen silicon integrated circuits enter into an increasing number of technical and consumer applications, until they now affect everyday life, as well as technical areas. Polycrystalline silicon has been an important component of silicon technology for nearly two decades, being used first in MOS integrated circuits and now becoming pervasive in bipolar circuits, as well. During this time a great deal of informa- tion has been published about polysilicon. A wide range of deposition conditions has been used to form films exhibiting markedly different properties. Seemingly contradictory results can often be explained by considering the details of the structure formed. This monograph is an attempt to synthesize much of the available knowledge about polysilicon. It represents an effort to interrelate the deposition, properties, and applications of polysilicon so that it can be used most effectively to enhance device and integrated-circuit perfor- mance. As device performance improves, however, some of the proper- ties of polysilicon are beginning to restrict the overall performance of integrated circuits, and the basic limitations of the properties of polysili- con also need to be better understood to minimize potential degradation of circuit behavior.
Recent years have seen silicon integrated circuits enter into an increasing number of technical and consumer applications, until they now affect everyday life, as well as technical areas. Polycrystalline silicon has been an important component of silicon technology for nearly two decades, being used first in MOS integrated circuits and now becoming pervasive in bipolar circuits, as well. During this time a great deal of informa- tion has been published about polysilicon. A wide range of deposition conditions has been used to form films exhibiting markedly different properties. Seemingly contradictory results can often be explained by considering the details of the structure formed. This monograph is an attempt to synthesize much of the available knowledge about polysilicon. It represents an effort to interrelate the deposition, properties, and applications of polysilicon so that it can be used most effectively to enhance device and integrated-circuit perfor- mance. As device performance improves, however, some of the proper- ties of polysilicon are beginning to restrict the overall performance of integrated circuits, and the basic limitations of the properties of polysili- con also need to be better understood to minimize potential degradation of circuit behavior.

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