Jacopo Iannacci is Researcher in MEMS technology at the Fondazione Bruno Kessler - FBK in Trento, Italy, where he focuses on (compact) modeling, design, optimization, integration, packaging and testing for reliability of MEMS/RF-MEMS devices and networks for sensors/actuators, energy harvesting and telecommunication systems. He received the PhD in Information Technology from the ARCES Research Center of the University of Bologna, Italy, and worked as Visiting Researcher at the DIMES Technology Center of the Technical University of Delft, the Netherlands, on development of packaging and integration solutions for RF-MEMS devices. Jacopo Iannacci authored and co-authored numerous scientifi c contributions for international journals and conference proceedings, as well as books and several book chapters in the fi eld of MEMS and RFMEMS technology.

Providing researchers and engineers with invaluable practical hints on how to develop novel RF-MEMS device concepts, this book deals with modeling, design, simulation, optimization, fabrication and characterization of MEMS for radiofrequency applications.

PREFACERF-MEMS APPLICATIONS AND THE STATE OF THE ARTIntroductionA Brief History of MEMS and RF-MEMS from the Perspective of TechnologyRF-MEMS Lumped ComponentsRF-MEMS Complex NetworksModeling and Simulation of RF-MEMS DevicesPackaging of RF-MEMSBrief Overview of Exploitation of RF-MEMS in RF SystemsConclusionsTHE BOOK IN BRIEFIntroductionA Brief Introduction to the FBK RF-MEMS TechnologyAn RF-MEMS Series Ohmic Switch (Dev A)RF-MEMS Capacitive Switches/VaractorsConclusionsDESIGNIntroductionDesign Rules of the Fondazione Bruno Kessler RF-MEMS TechnologyDesign of an RF-MEMS Series Ohmic Switch (Dev A)Generation of 3D Models Starting from the 2D LayoutConclusionsSIMULATION TECHNIQUES (COMMERCIAL TOOLS)IntroductionStatic Coupled Electromechanical Simulation of the RF-MEMS Ohmic Switch (Dev A) in ANSYS MultiphysicsModal Analysis of the RF-MEMS Capacitive Switch (Dev B2) in ANSYS MultiphysicsCoupled Thermoelectromechanical Simulation of the RF-MEMS Ohmic Switch with Microheaters (Dev C) in ANSYS MultiphysicsRF Simulation (S-parameters) of the RF-MEMS Variable Capacitor (Dev B1) in ANSYS HFSS?ConclusionsON-PURPOSE SIMULATION TOOLSIntroductionMEMS Compact Model LibraryA Hybrid RF-MEMS/CMOS VCOExcerpts of Verilog-A Code Implemented for MEMS ModelsConclusionsPACKAGING AND INTEGRATIONIntroductionA WLP Solution for RF-MEMS Devices and NetworksEncapsulation of RF-MEMS DevicesFabrication Run of Packaged Test StructuresElectromagnetic Characterization of the PackageInfluence of Uncompressed ACA on the RF Performance of Capped MEMS DevicesConclusionsPOSTFABRICATION MODELING AND SIMULATIONSIntroductionElectromechanical Simulation of an RF-MEMS Varactor (Dev B2) with Compact ModelsRF Modeling of an RF-MEMS Varactor (Dev B2) with a Lumped Element NetworkElectromechanical Modeling of an RF-MEMS Series Ohmic Switch (Dev A) with Compact ModelsElectromagnetic Modeling and Simulation of an RF-MEMS Impedance- Matching Network (Dev E) for a GSM CMOS Power AmplifierElectromagnetic Simulation of an RF-MEMS Capacitive Switch (Dev B1) in ANSYS HFSSElectromagnetic Simulation of a MEMS-Based Reconfigurable RF Power Attenuator (Dev D) in ANSYS HFSSConclusionsAPPENDIX A RIGID PLATE ELECTROMECHANICAL TRANSDUCER (COMPLETE MODEL)IntroductionMechanical Model of the Rigid Plate with Four DOFsExtension of the Mechanical Model of the Rigid Plate to Six DOFsContact Model for Rigid Plates with Four and Six DOFsElectrostatic Model of the Rigid PlateElectrostatic Model of the Plate with HolesElectrostatic Model of the Fringing EffectViscous Damping ModelConclusionsAPPENDIX B FLEXIBLE STRAIGHT BEAM (COMPLETE MODEL)Mechanical Model of the Flexible Beam with Two Degrees of FreedomMechanical Model of the Flexible Beam with 12 DOFsComplete Mechanical Model of the Euler Beam with 12 DOFsElectrostaticModel of the Euler Beamwith 12 DOFsViscous Damping ModelConclusionsINDEX

Providing researchers and engineers with invaluable practical hints on how to develop novel RF-MEMS device concepts, this book deals with modeling, design, simulation, optimization, fabrication and characterization of MEMS for radiofrequency applications.To begin with, prototypical RF-MEMS devices, including lumped components and complex networks, are presented as reference examples, and these are then discussed from different perspectives with regard to design, simulation, packaging, testing, and post-fabrication modeling. The text explicitly treats the hard-to-predict interplay between the three-dimensional device structure and its electromagnetic functionality.Theoretical concepts are introduced when necessary to complement the practical hints given for all RF-MEMS development stages, and simulation results are validated against experimental results.With its design and simulation examples based on such widely-known software packages as ANSYS and the hardware description language Verilog, this guide will appeal to the practice-oriented R&D reader.