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Reliability of MEMS

Testing of Materials and Devices
 E-Book
Sofort lieferbar | Lieferzeit: Sofort lieferbar I
ISBN-13:
9783527675036
Veröffentl:
2013
Einband:
E-Book
Seiten:
324
Autor:
Oliver Brand
eBook Typ:
PDF
eBook Format:
Reflowable E-Book
Kopierschutz:
Adobe DRM [Hard-DRM]
Sprache:
Englisch
Beschreibung:

This first book to cover exclusively and in detail the principles, tools and methods for determining the reliability of microelectromechanical materials, components and devices covers both component materials as well as entire MEMS devices. Divided into two major parts, following a general introductory chapter to reliability issues, the first part looks at the mechanical properties of the materials used in MEMS, explaining in detail the necessary measuring technologies -- nanoindenters, bulge methods, bending tests, tensile tests, and others. Part Two treats the actual devices, organized by important device categories such as pressure sensors, inertial sensors, RF MEMS, and optical MEMS.
This edition of 'Reliability of MEMS' was originally published in the successful series 'Advanced Micro & Nanosystems'. Here, one of the most important hurdles to commercialization for microelectromechanical systems is covered in detail: the reliability of MEMS materials and devices. Due to their microscale size combined with novel functionalities, a whole new category of challenges arises, and proper determination of a given device's reliability is instrumental in determining its range of usability and application fields. Any kind of gadget's performance, lifetime and safety will depend on the continued and predictable functioning of both the electronic as well as the micromechanical parts. MEMS reliability therefore can be as serious as human life-and-death matters - quite literally in the case of roll-over sensors for cars, for example.
PREFACEEVALUATION OF MECHANICAL PROPERTIES OF MEMS MATERIALS AND THEIR STANDARDIZATIONELASTOPLASTIC INDENTATION CONTACT MECHANICS OF HOMOGENEOUS MATERIALS AND COATING?SUBSTRATE SYSTEMSTHIN-FILM CHARACTERIZATION USING THE BULGE TESTUNIAXIAL TENSILE TEST FOR MEMS MATERIALSON-CHIP TESTING OF MEMSRELIABILITY OF A CAPACITIVE PRESSURE SENSORINERTIAL SENSORSINERTIAL SENSORSRELIABILITY OF MEMS VARIABLE OPTICAL ATTENUATORECO SCAN MEMS RESONANT MIRRORINDEX

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