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  1. Force Sensors for Microelectronic Packaging Applications
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    Force Sensors for Microelectronic Packaging Applications

    Ebook
    Sofort lieferbar

    Intended for wire-bonding and flip-chip packaging professionals and for scientists and enginee...

    Unser bisheriger Preis:ORGPRICE: 111,04 €

    Jetzt 96,28 €
    Alle Preise inkl. MwSt
  2. Force Sensors for Microelectronic Packaging Applications

    Buch
    Besorgungstitel - wird vorgemerkt

    Intended for wire-bonding and flip-chip packaging professionals and for scientists and enginee...

    106,99 €
    Alle Preise inkl. MwSt | Versandkostenfrei
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